Yield of dies by adding dummy pattern on open area of multi-project mask

Abstract

A method of improving yields of dies by adding dummy pattern on open area of multi-project mask is disclosed. Pattern of multi-project mask comprises a main pattern corresponding to a configuration of patterns of different dies and numerous dummy patterns that occupy, even substantially entirely, open area of multi-project mask, where dummy pattern and main pattern are separated by scribing lines. After patterns of multi-project mask are transformed to semiconductor wafer, dies and dummy dies are formed. Obviously, when the semiconductor wafer is treated by some processes such as chemical mechanical polishing and etching, because dies are close to dummy dies then boundaries of dies are protected and then these is no damage on edge of each die.

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