Film forming method and film forming apparatus

A film forming method for forming a film of a coating solution on a substrate, comprising the steps of:

• spreading the coating solution supplied to a center of the substrate by rotating the substrate;
• supplying solvent vapor of the coating solution onto the substrate before the supply of the coating solution;
• thereafter supplying the coating solution to the substrate and spreading the supplied coating solution by rotating the substrate at a first rotation speed;
• thereafter rotating the substrate at a second rotation speed higher than the first rotation speed to spread the coating solution over an entire surface of the substrate;
• and
• thereafter rotating the substrate at a third rotation speed lower than the second rotation speed while supplying the solvent vapor of the coating solution to the entire surface of the substrate to thin the film of the coating solution spread over the substrate.

A film forming method for forming a film of a coating solution on a substrate, comprising the steps of:

• spreading the coating solution supplied to a center of the substrate by rotating the substrate;
• supplying solvent vapor of the coating solution onto the substrate before the supply of the coating solution;
• thereafter supplying the coating solution to the substrate and spreading the supplied coating solution by rotating the substrate at a first rotation speed;
• thereafter rotating the substrate at a second rotation speed higher than the first rotation speed to spread the coating solution over an entire surface of the substrate;
• and
• thereafter rotating the substrate at a third rotation speed lower than the second rotation speed while maintaining a solvent atmosphere with a predetermined concentration at least in the vicinity of the substrate to thin the film of the coating solution spread over the substrate.

A film forming method for forming a film of a coating solution on a substrate, comprising the steps of:

• spreading the coating solution supplied to a center of the substrate by rotating the substrate;
• supplying a solvent of the coating solution onto an entire surface of the substrate before the supply of the coating solution;
• rotating the substrate at a predetermined rotation speed to vaporize the solvent supplied onto the substrate;
• thereafter supplying the solvent of the coating solution again to at least a peripheral portion of the substrate;
• spreading the coating solution supplied to the substrate by rotating the substrate at a first rotation speed;
• and
• thereafter rotating the substrate at a second rotation speed higher than the first rotation speed to spread the coating solution over the entire surface of the substrate.