Substrate holding device, semiconductor manufacturing apparatus and device manufacturing method
AssigneeCanon Kabushiki Kaisha
InventorShin Matsui
Life of this patent
Estimating the term…
Abstract
A substrate holding device has a base member which removably holds a plate having a contact member to come into contact with a substrate, a first attraction mechanism which attracts the substrate onto the plate, and a second attraction mechanism which attracts the plate onto the base member. In this arrangement, as the plate can be removed, time to remove contaminants is not required, and productivity can be improved. Further, as the plate on a flat plate can be attached/removed, plate exchange can be easily made.
Claims60
A substrate holding device comprising:
- a base member capable of removably holding a plate having a contact member to come into contact with a substrate;
- a first attraction mechanism that attracts said substrate onto said plate in a status where said plate is held on said base member;
- and
- a second attraction mechanism that attracts said plate onto said base member.
A substrate holding device comprising:
- a base member capable of removably holding a plate having a contact member to come into contact with a substrate,
- wherein said base member flatten-corrects said plate by sucking said plate.
A substrate holding device comprising:
- a base member capable of removably holding a plate having a contact member to come into contact with a substrate,
- wherein rigidity of said base member is higher than that of said plate.
A substrate holding device comprising:
- a base member capable of removably holding a plate having a projection to come into contact with a substrate;
- and
- a projection, provided on said base member, that holds said plate,
- wherein said projection is provided on said base member so as to be positioned under the projection provided on said plate.
A substrate holding device comprising:
- a base member capable of removably holding a plate having a projection to come into contact with a substrate;
- and
- a projection, provided on said base member, that holds said plate,
- wherein said projection and the projection provided on said plate are coaxially provided.
A substrate holding device comprising:
- a base member capable of removably holding a plate having a projection to come into contact with a substrate;
- and
- a projection, provided on said base member, that holds said plate,
- wherein a central axis of the projection provided on said plate is positioned within an area of said projection provided on said base member.
A substrate holding device comprising:
- a base member capable of removably holding a plate having a projection to come into contact with a substrate;
- and
- a projection, provided on said base member, that holds said plate,
- wherein a central axis of said projection provided on said base member is positioned within a range of 5 mm from a center of the projection provided on said plate.
A substrate holding device comprising:
- a base member capable of removably holding a plate having a contact member to come into contact with a substrate;
- and
- a pressure control mechanism that controls pressure in a gap between said base member and said plate.
A substrate holding device comprising:
- a base member capable of removably holding a plate having a contact member to come into contact with a substrate;
- and
- a sensor that identifies an identification sign provided on said plate.
A semiconductor manufacturing apparatus comprising:
- a base member capable of removably holding a plate having a contact member to come into contact with a substrate;
- a first attraction mechanism that attracts said substrate onto said plate in a status where said plate is held on said base member;
- and
- a second attraction mechanism that attracts said plate onto said base member.
A semiconductor manufacturing apparatus comprising:
- a base member capable of removably holding a plate having a contact member to come into contact with a substrate,
- wherein said base member flatten-corrects said plate by sucking said plate.
A semiconductor manufacturing apparatus comprising:
- a base member capable of removably holding a plate having a contact member to come into contact with a substrate,
- wherein rigidity of said base member is higher than that of said plate.
A semiconductor manufacturing apparatus comprising:
- a base member capable of removably holding a plate having a projection to come into contact with a substrate;
- and
- a projection, provided on said base member, that holds said plate,
- wherein said projection is provided on said base member so as to be positioned under the projection provided on said plate.
The semiconductor manufacturing apparatus comprising:
- a base member capable of removably holding a plate having a projection to come into contact with a substrate;
- and
- a projection, provided on said base member, that holds said plate,
- wherein said projection and the projection provided on said plate are coaxially provided.
The semiconductor manufacturing apparatus comprising:
- a base member capable of removably holding a plate having a projection to come into contact with a substrate;
- and
- a projection, provided on said base member, that holds said plate,
- wherein a central axis of the projection provided on said plate is positioned within an area of said projection provided on said base member.
The semiconductor manufacturing apparatus comprising:
- a base member capable of removably holding a plate having a projection to come into contact with a substrate;
- and
- a projection, provided on said base member, that holds said plate,
- wherein a central axis of said projection provided on said base member is positioned within a range of 5 mm from a center of the projection provided on said plate.
The semiconductor manufacturing apparatus comprising:
- a base member capable of removably holding a plate having a contact member to come into contact with a substrate;
- and
- a pressure control mechanism that controls pressure in a gap between said base member and said plate.
The semiconductor manufacturing apparatus comprising:
- a base member capable of removably holding a plate having a contact member to come into contact with a substrate;
- and
- a sensor that identifies an identification sign provided on said plate.
Dependencies are inferred from the claim text.