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AssigneesFujitsu Hitachi Plasma Display Limited, Fuji Electric Co., Ltd.
InventorsHirokazu Inoue, Toyoshi Kawada, Yuji Sano, Michitaka Ohsawa, Osamu Hirohashi
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A low-cost display driver module that shortens the process for connecting an integrated circuit chip and a wiring pattern on a flexible wiring board and uses a metal chassis on a display panel as a radiator. In this display driver module, an integrated circuit chip with bump electrodes on it is joined with pressure applied by the use of an anisotropic conductive film, an anisotropic conductive paste, a non-conductive resin paste, or a non-conductive resin film and the back of the integrated circuit chip is adhered to a metal chassis on a display panel by the use of an integrated-circuit chip adhesive. As a result, the metal chassis can be used as a radiator for the integrated circuit chip. Batch bonding will enable to shorten time for the connection process and to cut down the cost of installations. Furthermore, a radiator is unnecessary, resulting in a low-cost display driver module.
A display driver module for driving a flat panel display, the module comprising:
A mounting structure for a display driver module for mounting a driver integrated circuit for driving a plasma display panel by receiving signals from a drive circuit board and a display driver module having a wiring board on which the driver integrated circuit is mounted on the plasma display panel, wherein:
Dependencies are inferred from the claim text.