US 2001/0032985 A1 · Multi-chip semiconductor LED assembly

Abstract

A light emitting device includes several LEDs, mounted on a shared submount, and coupled to circuitry formed on the submount. The LEDs can be of the III-Nitride type. The architecture of the LEDs can be either inverted, or non-inverted. Inverted LEDs offer improved light generation. The LEDs may emit light of the same wavelength or different wavelengths. The circuitry can couple the LEDs in a combination of series and parallel, and can be switchable between various configurations. Other circuitry can include photosensitive devices for feedback and control of the intensity of the emitted light, or an oscillator, strobing the LEDs.

Claims34

Dependent claims

A light emitting device, comprising

one or more light emitting diodes, positioned on a shared submount;
and
circuitry, on said shared submount, wherein said one or more light emitting diodes are coupled to said circuitry.

Dependencies are inferred from the claim text.

Facts

Application

09/859,154Filed 15 May 2001

Priority

22 Dec 1999

Published

25 Oct 2001

Term ends

Not estimatedThe source records don’t support an estimate.

Classification22 codes

H10H 20/8215
Bodies: characterised by crystalline imperfections, e.g. dislocations; characterised by the distribution of dopants, e.g. delta-doping
H10H 20/835
Characterised by their material: reflective materials
H10W 72/20
Interconnections or connectors in packages: bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
H10W 90/00
Package configurations

Multi-chip semiconductor LED assembly

Life of this patent

Multi-chip semiconductor LED assembly

Life of this patent

Abstract

Claims34