Thermal joint and method of use

A device comprising:

• a heat-generating component;
• a heat-dissipating component;
• and
• a thermal joint positioned between the heat-generating component and the heat-dissipating component, the thermal joint comprising an alloy of at least two constituents, the alloy including at least a liquid phase and at least a solid phase, the liquid phase being substantially in equilibrium with the solid phase;
• wherein the alloy has an operating temperature TP, a liquid temperature TL, and a solid temperature TS, and the operating temperature TP falls between the liquid temperature TL and the solid temperature TS.

A method of dissipating heat, comprising:

• providing a thermal joint between a heat-generating component and a heat-dissipating component, the thermal joint comprising an alloy of at least two constituents, the alloy has a liquid temperature TL, and a solid temperature TS;
• and
• operating the thermal joint at a temperature between the liquid temperature TL and the solid temperature TS
• wherein the alloy includes at least a liquid phase and at least a solid phase, and the liquid phase is substantially in equilibrium with the solid phase.

A method making a thermal joint with low thermal resistance, comprising:

• providing an alloy of at least two constituents, the alloy having a liquid temperature TL, and a solid temperature TS;
• placing the alloy between a heat-generating component and a heat-dissipating component, thereby defining at least one interface having interfacial voids and
• subjecting the alloy to an operating temperature above the solid temperature TS to generate a liquid phase to fill the interfacial voids;
• and
• lowering the operating temperature below the liquid temperature TL.