US 2001/0027082 A1 · Cluster tool systems and methods for in fab wafer processing

Abstract

The present invention provides exemplary cluster tool systems and methods for processing wafers, such as semiconductor wafers. One method includes providing (710) a wafer having initial thickness variations between two wafer surfaces. The wafer is subjected to grinding (720), polishing (730) and cleaning (740) processes. The wafer is thereafter transferred (750) to a wafer processing chamber to undergo device formation processes (760-780). The wafer processing steps may be undertaken in a series of process modules of sufficiently small size to permit their use in a circuit device fabrication facility. The in-fab processing of wafers reduces the number of process steps, cost and time typically associated with wafer processing prior to device formation thereon.

Claims19

Dependent claims

A method of processing a wafer, comprising:

providing a wafer having initial thickness variations between two surfaces of said wafer;
processing said wafer through a first module, said first module comprising apparatus for performing a grinding process and said processing therethrough includes said grinding process;
processing said wafer through a second module, said second module comprising apparatus for performing a double side polish (DSP) process, and said processing therethrough includes said DSP process;
processing said wafer through a third module, said third module comprising an apparatus for performing a finish polish process, and said processing therethrough includes said finish polish process;
cleaning said wafer after said processing through said third module;
and
thereafter transferring said wafer to a wafer processing chamber within a same facility as that containing said first, second and third modules.

4 more elements

Dependencies are inferred from the claim text.

Cluster tool systems and methods for in fab wafer processing

Life of this patent

Cluster tool systems and methods for in fab wafer processing

Life of this patent

Abstract

Claims19