Anisotropically electroconductive adhesive material and connecting method
AssigneeSony Chemicals Corp.
InventorsYasuhiro Suga, Motohide Takeichi
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Abstract
An anisotropically electroconductive adhesive material is configured of a thermosetting resin and electroconductive particles dispersed in the thermosetting resin, wherein a 10% modulus of compressive elasticity (E) in the electroconductive particles and the modulus of longitudinal elasticity (E′) of the projecting electrodes of the electronic element to be connected by the anisotropically electroconductive adhesive material satisfy the below relational Formula (1). 0.02≦E/E′≦0.5 (1)
Claims4
An anisotropically electroconductive adhesive material, comprising a thermosetting resin and electroconductive particles dispersed in the thermosetting resin, wherein a 10% modulus of compressive elasticity (E) in said electroconductive particles and a modulus of longitudinal elasticity (E′) of projecting electrodes of an electronic element to be connected by said anisotropically electroconductive adhesive material satisfy the below Relational Formula (1).
- 0.02≦E/E′≦0.5 (1)
A connecting method, comprising sandwiching an anisotropically electroconductive adhesive material, in which electricoconductive particles have been dispersed in a thermosetting resin, between projecting electrodes of an electronic element and the connecting pads of a wiring board, and applying heat and pressure thereto to make a connection therebetween while ensuring continuity between the electrical element and the wiring board, wherein, in the anisotropically electroconductive adhesive material, a 10% modulus of compressive elasticity (E) in the electroconductive particles and a modulus of longitudinal elasticity (E′) of the projecting electrodes of the electronic element that satisfy the Relational Formula (1) below.
- 0.02≦E/E′≦0.5 (1)
Dependencies are inferred from the claim text.