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US 2001/0026441 A1Published application
Printed wiring board having heat radiating means and method of manufacturing the same
AssigneeRohm Co., Ltd.
InventorSatoshi Nakamura
Life of this patent
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Abstract
In the present invention, a printed wiring board with an electronic component face-mounted on a circuit board in which the electronic component is provided with a heat radiating plate for conducting heat internally generated, is characterized in that the heat radiating means is face-mounted at a position corresponding to the electronic component on a rear surface of the circuit board.
Claims14
A printed wiring board with an electronic component face-mounted on a circuit board in which the electronic component is provided with a heat radiating plate for conducting heat internally generated, comprising:
- heat radiating means face-mounted at a position corresponding to the electronic component on a rear surface of the circuit board.
Dependencies are inferred from the claim text.