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AssigneeShowa Denko K.K.
InventorsMasahiro Amemiya, Satoshi Saito, Katsuji Yano, Kunio Matsuki
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An object of the present invention is to provide a new cleaning agent composition having excellent cleaning power for the surface contamination of a semiconductor wafer or various precisely worked instruments made of glass or ceramic, which is used in the manufacture of wafer; a method for cleaning a wafer; a semiconductor wafer having a surface cleaned by a cleaning method; and a method for manufacturing a semiconductor wafer. A semiconductor wafer is cleaned using a cleaning agent composition including a specific fluorine-containing anionic surfactant, a quaternary ammonium hydroxide and/or an alkanolamine.
A cleaning agent composition comprising (A) from 0.0001 to 5 mass % of a fluorine-containing anionic surfactant and at least one of (B) from 0.001 to 30 mass % of a quaternary ammonium hydroxide and (C) from 0.01 to 20 mass % of an alkanolamine.
A semiconductor wafer comprising a surface cleaned by a cleaning method, comprising the following cleaning steps:
Dependencies are inferred from the claim text.