Integrated device microfluid thermoregulation, and manufacturing process thereof

A process for manufacturing an integrated device for microfluid thermoregulation, comprising:

• forming a semiconductor material body having a surface;
• forming at least a buried channel extending in said semiconductor material body, arranged at a distance from said surface, and having a first and a second end;
• forming at least a first and a second port extending from said surface respectively as far as said first and second ends of said buried channel, and being in fluid connection with said buried channel;
• and
• forming at least a heating element on said semiconductor material body.

A device for microfluid thermoregulation comprising:

• at least one buried channel formed a predetermined distance beneath a surface of a semiconductor material body;
• first and second ports formed in the semiconductor material body and in fluid communication with the surface of the semiconductor material body and with first and second ends, respectively, of the at least one buried channel;
• and
• at least one heating element formed on the surface of the semiconductor material body and positioned over the at least one buried channel to heat fluid in the at least one buried channel.

A method for manufacturing a device for microfluid thermoregulation, comprising:

• forming at least one buried channel a predetermined distance beneath a surface of a semiconductor material body;
• forming first and second ports in the semiconductor material body to be in fluid communication with the surface of the semiconductor material body and with first and second ends, respectively, of the at least one buried channel;
• and
• forming at least one heating element on the surface of the semiconductor material body to be positioned over the at least one buried channel for heating fluid in the at least one buried channel.