Apparatus and method for the visual inspection in particular of concealed soldered joints
AssigneeERSA GmbH
InventorMark Cannon
Life of this patent
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AssigneeERSA GmbH
InventorMark Cannon
Estimating the term…
An apparatus for the visual inspection in particular of concealed soldered joints is provided, in particular between an electric or electronic component disposed on the surface of a printed circuit board and the printed circuit board. The apparatus includes with an ocular unit, a lens head, an image transmission unit for transmitting the image received by the lens head to the ocular unit and an illuminating device for illuminating the soldered joints to be tested. The lens head includes a device for image deviation which extends up to the axially outer end of the lens head, and in which the illuminating device is disposed in the lens head in such a way that the exit angle of the light of the illuminating device out of the lens head is substantially equal to the deviation angle of the image deviation. The exit point of the light is disposed next to the device for image deviation in the area of the axially outer end of the lens head.
An apparatus for the visual inspection of soldered joints between an electric or electronic component disposed on the surface of a printed circuit board and the printed circuit board, the apparatus comprising:
A method for checking the quality of the soldered joint between an electric or electronic component disposed on the surface of a printed circuit board or similar including an SMD, BGA, CSP or FC component, and the printed circuit board, the method comprising the steps of:
An apparatus for the visual inspection of soldered joints disposed between an electric or electronic component and a substrate, the apparatus comprising:
A visual inspection apparatus comprising:
Dependencies are inferred from the claim text.