Semiconductor device package and optical communication device
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsMasanori Iida, Hiroyuki Asakura
Life of this patent
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Abstract
A semiconductor device package, has a heat radiating base that has a depression; a circuit substrate disposed on the heat radiating base so as to cover at least the depression; and at least two semiconductor devices at least one of which is mounted on each of one and the other major surfaces of the circuit substrate, wherein the semiconductor device mounted on one major surface of the circuit substrate coupled to the heat radiating base is disposed in the depression, and is coupled to at least a part of the depression with good thermal conductivity.
Claims19
A semiconductor device package, comprising:
- a heat radiating base that has a depression;
- a circuit substrate disposed on said heat radiating base so as to cover at least said depression;
- and
- at least two semiconductor devices at least one of which is mounted on each of one and the other major surfaces of said circuit substrate,
- wherein said semiconductor device mounted on one major surface of said circuit substrate coupled to said heat radiating base is disposed in said depression, and is coupled to at least a part of said depression with good thermal conductivity.
Dependencies are inferred from the claim text.