Electronic device having fibrous interface
AssigneeHoneywell International Inc.
InventorsCharles Smith, Michael M. Chau, Roger A. Emigh, Nancy F. Dean
Life of this patent
Estimating the term…
Abstract
Described is an electronic device having a compliant fibrous interface. The interface comprises a free fiber tip structure having flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive and an encapsulant between the portions of the fibers that extend out of the adhesive and the fiber's free tips.
Claims45
In an electronic device comprising a substrate and a semiconductor die, the improvement comprising a compliant fibrous interface, said interface comprising a free fiber tip structure between the substrate and semiconductor die, said free fiber tip structure comprising flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive and encapsulant disposed between the portions of the fibers that extend out of the adhesive and beneath the free tips of the fibers.
A semiconductor assembly comprising a semiconductor package having a lid, a semiconductor die disposed in the package, an interface comprising a free fiber tip structure between the semiconductor die and the lid of the package, said free fiber tip structure comprising flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive and encapsulant disposed between the portions of the fibers that extend out of the adhesive beneath the free tips of the fibers.
A semiconductor assembly comprising a semiconductor package having a lid;
- a semiconductor die disposed in the package;
- a first interface comprising a free fiber tip structure between the semiconductor die and the lid of the package, said free fiber tip structure comprising flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive and encapsulant disposed between the portions of the fibers that extend out of the adhesive and beneath free tips of the fibers;
- a heat sink;
- a second interface comprising a free fiber tip structure between the lid of the package and the heat sink, said second free fiber tip structure comprising flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive and encapsulant disposed between the portions of the fibers that extend out of the adhesive and beneath free tips of the fibers.
A combination suitable for use in an electronic device comprising a heat sink and an interface comprising a free fiber tip structure, said free fiber tip structure comprising flocked thermally conductive fibers embedded in a substrate in substantially vertical orientation with portions of the fibers extending out of the substrate and encapsulant disposed between the portions of the fibers that extend out of the substrate and beneath the tips of the fibers.
A method of making a semiconductor assembly comprising:
- a) providing thermally conductive fibers of desired length;
- b) applying adhesive to a substrate;
- c) flocking the fibers to the substrate and embedding said fibers into the adhesive with a portion of the fibers extending out of the adhesive;
- d) curing the adhesive;
- e) disposing a curable encapsulant between fibers extending out of the adhesive and beneath the free tips of the fibers;
- f) compressing the fibers with encapsulant between the fibers into the adhesive to less than the nominal fiber length and clamp to the compressed height;
- g) curing the encapsulant while under compression to yield a free fiber tip structure with fiber tips extending out of the adhesive;
- and
- h) interposing the free fiber tip structure between a semiconductor die and a substrate.
A method of making a semiconductor assembly comprising a semiconductor package having a lid, a semiconductor die disposed in the package and a heat sink comprising:
- a) providing thermally conductive fibers of desired length;
- b) applying adhesive to a substrate;
- c) flocking the fibers to the substrate and embedding the fibers at one end into the adhesive with tips of the fibers extending out of the adhesive;
- d) curing the adhesive;
- e) filling space between fibers extending out of the adhesive and beneath the tips of the fibers with a curable encapsulant;
- f) compressing the fibers in the adhesive with encapsulant in the spaces between the fibers into the adhesive to less than the nominal fiber length and clamp to the compressed height;
- g) curing the encapsulant to yield a free fiber tip structure with fiber tips extending out of the adhesive;
- and
- h) interposing the free fiber tip structure between a semiconductor die and the lid.
A method of making a semiconductor assembly comprising a semiconductor package having a lid and a semiconductor die disposed in the package comprising:
- a) providing thermally conductive fibers of desired length;
- b) applying adhesive to a substrate;
- c) flocking the fibers to the substrate and embedding the fibers at one end into the adhesive with tips of the fibers extending out of the adhesive;
- d) curing the adhesive;
- e) filling space between fibers extending out of the adhesive beneath the tips of the fibers with a curable encapsulant;
- f) compressing the fibers in the adhesive with encapsulant between the fibers to less than the nominal fiber length and clamp to the compressed height;
- g) curing the encapsulant to yield a free fiber tip structure with fiber tips extending out of the adhesive;
- and
- h) interposing the free fiber tip structure between a semiconductor die and the lid and between the lid and the heat sink.
A combination for use in a semiconductor assembly comprising a package containing a semiconductor die, a heat sink device and an interface between the package and heat sink device, said interface comprising a free fiber tip structure comprising flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive, and encapsulant disposed between the portions of the fibers that extend out of the adhesive and beneath the free tips of the fibers.
A combination for use in a semiconductor assembly comprising a lid, and an interface comprising a free fiber tip structure, said free fiber tip structure comprising flocked thermally conductive fibers embedded in a substrate in substantially vertical orientation with portions of the fibers extending out of the substrate and encapsulant disposed between the portions of the fibers that extend out of the substrate and beneath the tips of the fibers.
A combination comprising a heat spreader and an interface comprising a free fiber tip structure, said free fiber tip structure comprising flocked thermally conductive fibers embedded in a substrate in substantially vertical orientation with portions of the fibers extending out of the substrate and encapsulant disposed between the portions of the fibers that extend out of the substrate and beneath the tips of the fibers.
An interface comprising a free fiber tip structure adapted for use in a semiconductor assembly, said free fiber tip structure comprising flocked thermally conductive fibers embedded in a substrate in substantially vertical orientation with portions of the fibers extending out of the substrate and encapsulant disposed between the portions of the fibers that extend out of the substrate and beneath the tips of the fibers.
Dependencies are inferred from the claim text.