US 2001/0023937 A1 · Carbon-reinforced PC-ABS composition and articles made from same

Abstract

Carbon fiber-filled PC-ABS resin compositions which have improved electrical properties at a given level of carbon fibers, and which do not suffer from as significant a decrease in impact strength as would result from the introduction of generic carbon fibers are achieved using carbon fibers treated with a polyamide terpolymer binder. The bundles are dispersed within the PC-ABS blend. The compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and/or EMI shielding. Such articles include, but are not limited to electronic devices, dust handling equipment and notebook computer enclosures.

Claims17

Dependent claims

A composition comprising:

(a) a thermoplastic resin comprising a blend of polycarbonate and acrylonitrile-butadiene-styrene copolymer;
and
(b) carbon fibers associated into bundles with a polyamide terpolymer binder, said bundles being dispersed within the thermoplastic resin.

Dependencies are inferred from the claim text.

Facts

Application

09/794,175Filed 27 Feb 2001

Priority

3 Feb 2000

Published

27 Sep 2001

Term ends

Not estimatedThe source records don’t support an estimate.

Classification11 codes

H01B 1/24
Conductive material dispersed in non-conductive organic material: the conductive material comprising carbon-silicon compounds, carbon or silicon
B29C 45/0001
Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor: characterised…
B29C 45/0005
Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor: using fibre…
C08K 7/06
Inorganic: elements

Carbon-reinforced PC-ABS composition and articles made from same

Life of this patent

Carbon-reinforced PC-ABS composition and articles made from same

Life of this patent

Abstract

Claims17