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US 2001/0023534 A1Published application
Bent wire forming method
AssigneeKabushiki Kaisha Shinkawa
InventorsHideaki Tamai, Yasuyuki Komachi
Life of this patent
Estimating the term…
Abstract
So as to obtain a stable high-quality shape without being affected by the back tension in a bonding wire, after forming a pin-form wire by a wire bonding apparatus, a capillary of the bonding apparatus, with the formed pin-form wire inside the capillary, is moved along a curved path that has a shape of a bent wire to be formed.
Claims6
A bent wire forming method comprising the steps of:
- forming a pin-form wire by means of a wire bonding apparatus;
- and
- moving a capillary of said wire bonding apparatus along a curved path with said pin-from wire inside said capillary.
A bent wire forming method comprising the steps of:
- forming a pin-form wire by means of a wire bonding apparatus;
- moving a capillary of said wire bonding apparatus along a curved path with said pin-from wire inserted in said capillary and with a wire separated from said pin-form wire inside said capillary.
A bent wire forming method comprising said steps of:
- forming a pin-form wire by means of a wire bonding apparatus;
- allowing said pin-from wire to be entered into an empty capillary, and
- moving said capillary along a curved path.
Dependencies are inferred from the claim text.