Method of increasing package reliability using package lids with plane CTE Gradients

Abstract

A package for mounting an integrated circuit chip includes a body having at least a first region and a second region. The first region has a first coefficient of thermal expansion (CTE), and the second region has a second, different CTE. The first region approximately matches the CTE of the integrated circuit chip mounted on the package, and the second region approximates the CTE of the printed wiring board to which the package is mounted.

Dependencies are inferred from the claim text.