Wire bonding method, surface acoustic wave apparatus and method for producing surface acoustic wave apparatus
AssigneeMurata Manufacturing Co., Ltd.
InventorsNorihiko Takada, Hisamitsu Kamenaga, Shingo Iwasa
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Abstract
A wire bonding method for ultrasonically joining two connecting electrodes with a wire includes the steps of forming at least one of the connecting electrodes with tantalum and forming the wire of one of a metallic wire having a fracture load of about 21 g or greater and a metallic wire having a fracture stress of 290 N/mm2 or greater.
Claims16
A wire bonding method for ultrasonically joining two connecting electrodes with a wire, the wire bonding method comprising the steps of:
- forming at least one of the connecting electrodes with tantalum;
- and
- forming the wire from one of a metallic wire having a fracture load of about 21 g or greater and a metallic wire having a fracture stress of about 290 N/mm2 or greater.
A surface acoustic wave apparatus comprising:
- a package having an element-mounting surface, an electrode pad provided inside the package and an external connecting electrode provided outside the package and electrically connected to the electrode pad;
- a surface acoustic wave element fixed on the element-mounting surface of the package, the surface acoustic wave element including a piezoelectric substrate, an interdigital transducer provided on the piezoelectric substrate and made of tantalum and a bonding electrode electrically connected to the interdigital transducer and made of tantalum;
- and
- a bonding wire connected between the electrode pad and the bonding electrode, the bonding wire having one of a fracture stress of about 290 N/mm2 or greater and a fracture load of about 21 g or greater.
A method for producing a surface acoustic wave apparatus comprising the steps of:
- fixing a surface acoustic wave element on an element-mounting surface of a package having an electrode pad provided inside the package and an external connecting electrode provided outside the package and electrically connected to the electrode pad, the surface acoustic wave element including a piezoelectric substrate, an interdigital transducer provided on the piezoelectric substrate and made of tantalum and a bonding electrode electrically connected to interdigital transducer and made of tantalum;
- and
- electrically connecting the electrode pad and the bonding electrode via a bonding wire by disposing the bonding wire between the electrode pad and the bonding electrode, the bonding wire having one of a fracture stress of 290 N/mm2 or greater and the bonding wire and a fracture load of about 21 g or greater.
Dependencies are inferred from the claim text.