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AssigneeUnaxis Deutschland GmbH
InventorsBernhard Cord, Gerd Deppich, Karl-Heinz Schuller, Oliver Keitel
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A target of an alloy of metals having different specific weights is used in a method for producing substrates that are coated with a layer comprising the same two metals by magnetron sputtering of the target. When sputtering such a target material, the metals of the alloy will sputter off with different sputtering characteristics with regard to a static angle a at which the sputtered off material leaves the target. For this reason, at the substrate to be sputter-coated, there occurs a demixing effect of these metals which will be deposited with a varying local ratio of the metals, that differs form the ratio of the metals in the alloy of the target. To counter-act this demixing phenomenon, the location of an electron trap formed by the magnetron field of the sputter source at the target with respect to the location of the substrate, is selected. By proving this electron trap and the resulting erosion profile on the target, the amount of deposited heavier metal to the amount of lighter metal is increased along the surface of the substrate.
A method for producing substrates that are coated with a layer comprising at least two distinct heavy elements (L, S) by magnetron sputtering of a target (6) of a compound of the two elements, where d is an interfacial distance between a substrate surface (5) of the substrate and a new target surface (6o), r is the radius of the substrate, RE is the radius of a site of maximum erosion (Emax) at an erosion profile (9) on the target of an electron trap forming the magnetron magnetic field (H) and substrate, RH is the radius of a site of maximum field strength (H) of the electron trap, parallel to the new target surface of a magnetron tunnel field (11) bringing about the erosion profile (9), the method comprising:
A method for producing an essentially centric erosion profile (9′) on a magnetron target, wherein, in a center of the target (A) a tunnel-shaped magnetic field (H9′) over the target sputter surface is generated, whereon the magnetic field lines, exit or penetrate along a target surface zone encircling the center (A) and directly in the region of center A, however with respect to an offset to the center, the field lines enter or exit the sputter surface, and the magnetic field with respect to the target sputter surface is rotated (ω) about the center (A).
A magnetron source with a target (6) and a movable magnet configuration driven about an axis (A) perpendicular to the new target surface, characterized in that the magnet configuration comprises at least one magnet collar (14, 14″) extending at least in a sector about the axis, as well as in the region of the axis of rotation (A), radially offset with respect to it, a magnet (M, 12″).
A sputter-coating chamber with a magnetron source with circular-disk or annularly shaped planar target (6) as well as a substrate mounting for receiving an annularly or circular-disk shaped substrate (7) coaxial (A) with the target (6) and spaced apart with respect to it, wherein the magnetron source generates at least one coaxial magnetron field (H9) revolving about the axis, characterized in that for the radial distance RH of the essentially circular site of maximum new target surface-parallel field strength (Hmax) and the substrate radius r:
Dependencies are inferred from the claim text.