US 2001/0022236 A1 · Substrate for power semiconductor modules with through-plating of solder and method for its production

Abstract

A substrate for power semiconductor modules with a through-plating of solder, includes two metal plates and a ceramic plate which is seated as a layer between the metal plates and has a through hole formed therein. The substrate is plated through by making a through hole in one of the metal plates in alignment with the through hole in the ceramic plate and applying a paste solder to one side of the substrate. The substrate is then subjected to a furnace step, so that the paste solder flows into the through holes and the solder makes a permanent contact between the two metal plates. A method for producing the substrate is also provided.

Claims10

Dependent claims

A method for through-plating a substrate for power semiconductor modules, which comprises:

providing two metal plates having outer surfaces facing away from each other;
providing a ceramic plate with a through hole;
seating the ceramic plate as a layer between the two metal plates;
forming a through hole in one of the metal plates in alignment with the through hole in the ceramic plate;
applying a paste solder to the outer surface of the one metal plate;
and
carrying out a furnace step causing the paste solder to flow into the through holes and make a permanent contact between the two metal plates with solder.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application

09/789,341Filed 20 Feb 2001

Priority

DE 100 07 414.618 Feb 2000

Published

20 Sep 2001

Term ends

Not estimatedThe source records don’t support an estimate.

Classification17 codes

H05K 3/4084
Through-connections; Vertical interconnect access [VIA] connections: by deforming at least one of the conductive layers
H10W 40/255
Characterised by their materials: having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
H10W 70/095
Of insulating or insulated package substrates, or of interposers, or of redistribution layers: of vias therein
H10W 70/098
Of insulating or insulated package substrates, or of interposers, or of redistribution layers: applying pastes or inks, e.g. screen printing

Substrate for power semiconductor modules with through-plating of solder and method for its production

Life of this patent

Substrate for power semiconductor modules with through-plating of solder and method for its production

Life of this patent

Abstract

Claims10