Method for fabricating a sealed-cavity microstructure
AssigneeDRS Sensors & Targeting Systems, Inc.
InventorsKenneth Maxwell Hays, Alan Glenn Bisignano, Eugene Timothy Fitzgibbons
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Abstract
A sealed cavity microstructure and an associated fabrication method are provided that incorporate both a tight pressure seal and a rugged structural bond. A rugged microstructure device incorporating a pressure-maintained cavity may thereby be fabricated. A vacuum cavity microbolometer is also provided that is fabricated using the associated method. The sealed cavity microstructure and the vacuum cavity microbolometer are thereby adapted to low-cost wafer-scale batch processing.
Claims20
A method of fabricating a microstructure with at least one pressure-maintained cavity, the method comprising steps of:
- providing first and second wafers, wherein at least one wafer defines a recessed portion;
- joining said first and second wafers such that the recessed portion of at least one of the wafers forms a cavity therebetween;
- forming a pressure seal between said first and second wafers to maintain a pre-determined pressure within said cavity;
- and
- forming a structural bond between said first and second wafers to structurally integrate at least a portion of said first and second wafers.
A microstructure with at least one pressure-maintained cavity, said microstructure comprising:
- first and second wafers defining a cavity therebetween;
- a pressure seal between said first and second wafers that extends peripherally about the cavity to maintain a pre-determined pressure within said cavity;
- and
- a structural bond between said first and second wafers to structurally integrate at least a portion of said first and second wafers.
A microbolometer comprising:
- first and second wafers defining a cavity therebetween;
- at least one radiation detector suspended within the cavity;
- a vacuum seal between said first and second wafers that extends peripherally about the cavity to maintain a vacuum within said cavity;
- and
- a structural bond between said first and second wafers to structurally integrate at least a portion of said first and second wafers.
Dependencies are inferred from the claim text.