Adjustable coarse alignment tooling for packaged semiconductor devices

An automated handler for positioning an integrated circuit, comprising:

• a loading mechanism for receiving and loading the integrated circuit into the automated handler;
• a handler boat for receiving the integrated circuit after being loaded into the automated handler by the loading mechanism and for transporting the integrated circuit within the handler, the handler boat having an adjustable singulated positioning apparatus having
• a base having an upper surface;
• and
• an adjustable guide having a plurality of guide members that define therebetween a recess into which the integrated circuit is placed for positioning, a first guide member being detachably coupled to the upper surface of the base and having an adjustable position along a first axis to adjust the shape or size of the recess;
• a handler chuck for receiving the integrated circuit from the handler boat and for positioning the integrated circuit to a predetermined orientation;
• and
• an unloading mechanism for receiving the integrated circuit after being positioned by the handler chuck and for unloading the integrated circuit from the automated handler.

A method for positioning first and second packaged semiconductor devices having first and second shapes, respectively, the method comprising:

• placing the first packaged semiconductor device into a recess partially defined by at least one adjustable guide member, the recess having a dimension to accommodate the first shape;
• removing the first packaged semiconductor device from the recess;
• adjusting the at least one adjustable guide member to redefine the recess to have a dimension to accommodate the second shape;
• and
• placing the second packaged semiconductor device into the recess partially defined by the at least one adjustable guide member.