Integrated circuit inductors

An inductor comprising:

• a substrate;
• a pair of substantially parallel rows of conductive columns providing a conductive path through the substrate;
• and
• a plurality of conductive segments interconnecting the pair of substantially parallel rows of conductive columns to form a coil.

An inductor comprising:

• a substrate having a plurality of substantially parallel holes, a plurality of substantially parallel surfaces, and a second plurality of substantially parallel surfaces approximately perpendicular to the plurality of substantially parallel surfaces;
• a coil intersecting the plurality of substantially parallel surfaces and filling the plurality of substantially parallel holes;
• and
• at least two leads operable for coupling to the coil from at least one of the second plurality of substantially parallel surfaces.

An inductor comprising:

• a substrate having a plurality of holes and a plurality of surfaces;
• a conductive material having a conductivity of at least copper and filling at least three of the plurality of holes to form a plurality of conductive segments;
• and
• a plurality of conductive interconnects formed on at least one of the plurality of surfaces and coupling to the plurality of conductive segments to form a continuous conductive coil.

An integrated circuit comprising:

• a substrate having a coating;
• a circuit formed on the substrate;
• and
• a conductive path operable for creating a magnetic field in the coating, and coupled to the circuit.

A memory system comprising:

• a substrate having a plurality of holes and a plurality of memory circuits;
• a magnetic film formed on the substrate;
• and
• a conductive path interwoven with the substrate and the magnetic film by routing the conductive path through the plurality of holes.

A computer system comprising:

• a processor;
• an inductive element comprising:
• a substrate having a pair of rows of a plurality of substantially parallel perforations;
• a magnetic film on the substrate;
• and
• a conductive path interlaced with the substrate through the plurality of substantially parallel perforations;
• and
• an electronic device coupled to the inductive element and the processor.

A computer system comprising:

• a processor;
• an inductor comprising:
• a substrate,
• a magnetic film on the substrate;
• and
• a conductive path operable for creating a reinforcing magnetic field within the magnetic film and within the substrate;
• and
• an electronic circuit operably coupled to the processor and the inductor.

An computer system comprising:

• a processor;
• an inductor comprising:
• a substrate;
• a magnetic film on the substrate;
• and
• a conductive path interwoven with the substrate and operable for creating
• a magnetic field in the magnetic film;
• and
• a power supply circuit coupled to the inductor and the processor.

A method comprising:

• drilling a plurality of holes in a substrate;
• filling the plurality of holes with a conductive material to form a plurality of conductive segments;
• and
• interconnecting the plurality of conductive segments to form a coil.

A method comprising:

• boring a plurality for substantially parallel perforations in a substrate having a pair of substantially parallel surfaces;
• plugging the plurality of substantially parallel perforations with a highly conductive material to form a highly conductive segment;
• and
• interconnecting the plurality of highly conductive segments to form a conductive path operable for producing a reinforcing magnetic field.

A method comprising:

• drilling a plurality of substantially parallel holes in a substrate having a plurality of substantially parallel surfaces;
• coating at least one of the substantially parallel surfaces with a magnetic material;
• filling the plurality of substantially parallel holes with a conductor to form a conductive segment;
• and
• interconnecting the plurality of conductive segments to form a coil operable for producing a magnetic field in the coating.

A method comprising:

• piercing a substrate having a plurality of substantially parallel surfaces to form a plurality of substantially parallel perforations;
• coating at least one of the substantially parallel surfaces with an insulating film;
• coating the insulating film with a magnetic film;
• coating the magnetic film with an insulating material;
• depositing in at least two of the plurality of substantially parallel perforations a conductor to form a plurality of conductive segments;
• and
• coupling the plurality of conductive segments with a conductive material to form a loop.