Plasma treatment apparatus and method
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsHiroshi Haji, Kiyoshi Arita
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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsHiroshi Haji, Kiyoshi Arita
Estimating the term…
A plasma treatment apparatus according to the present invention includes a vacuum chamber, an upper electrode and a lower electrode disposed in the vacuum chamber, a high-frequency power supply for applying a high-frequency voltage, a space adjusting device for adjusting the spacing between the two electrodes, and a workpiece-transfer-device for transferring to and from a space between the two electrodes. The plasma treatment apparatus can decrease the spacing between the two electrodes and thereby increase the etching rate. Further, the workpiece can be easily transferred to and from the space between the two electrodes by opening the spacing.
A plasma treatment apparatus comprising:
A method of plasma treatment comprising the steps of;
A plasma treatment apparatus comprising:
Dependencies are inferred from the claim text.