Back to results
US 2001/0018228 A1Published application
Connecting material and mounting method which uses same
AssigneeSony Chemicals Corp.
InventorHiroyuki Kumakura
Life of this patent
Estimating the term…
Abstract
A connecting material containing a thermosetting resin has a surface tension of 25 to 40 mN/m (at 25° C.). The connecting material contains a surfactant to adjust the surface tension to 25 to 40 mN/m (at 25° C.). The surfactant is a silicone resin-based surfactant or a fluorine resin-based surfactant. The ratio of surfactant content is 0.01 to 5.0 wt pts per 100 wt pts resin content in the connecting material.
Claims8
A connecting material containing a thermosetting resin, wherein the surface tension thereof at 25° C. is 25 to 40 mN/m.
Dependencies are inferred from the claim text.