Tape carrier type semiconductor device, method for manufacturing the same, and flexible substrate
AssigneeNEC LCD Technologies, Ltd.
InventorHideki Tanaka
Life of this patent
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Abstract
A tape carrier type semiconductor device includes a flexible substrate, on which a driver circuit is mounted and on whose surface wiring is formed. Formed in the flexible substrate are the first slit for releasing external stress and the second slit for folding the tape carrier type semiconductor device. A connector for connecting both sides of the first slit is prepared at the center of the slit, whereby the unnecessary warp of the tape carrier type semiconductor device can be reduced.
Claims18
A tape carrier type semiconductor device comprising:
- a flexible substrate on whose surface wiring is formed;
- and
- a driver circuit which is mounted on said flexible substrate and drives a device connected to said flexible substrate, and
- wherein said flexible substrate includes a first slit having a connector for connecting both sides of the first slit.
A tape carrier type semiconductor device comprising:
- a flexible substrate on whose surface wiring is formed;
- and
- a driver circuit which is mounted on said flexible substrate and drives a device connected to said flexible substrate, and
- wherein said flexible substrate includes a slit for folding said flexible substrate and a rib which is formed substantially perpendicular to the slit.
A method for manufacturing a carrier type semiconductor device, comprising forming a rib for reducing a warp of a flexible film on and in which a driver circuit and a slit are formed, by changing a shape of the flexible film, when the flexible film is cut into a predetermined length.
A flexible substrate, which includes a first slit having a connector for connecting both sides of the first slit, and on whose surface wiring having a predetermined pattern is formed.
Dependencies are inferred from the claim text.