Module with thin-film circuit
AssigneeKoninklijke Philips Electronics N.V.
InventorsCarlo Copetti, Martin Fleuster, Franciscus Hubertus Marie Sanders
Life of this patent
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Abstract
The invention describes a module provided with a thin-film circuit. To realize the module with thin-film circuit, capacitors, or capacitors and resistors, or capacitors, resistors and inductors are provided next to the conductor tracks directly on a substrate (1) of an insulating material. The partial or full integration of passive elements leads to the creation of a module which requires little space.
Claims17
A module provided with a thin-film circuit on a substrate (1) of an insulating material with at least one passive element, which element comprises at least
- a first structured electrically conducting layer (2),
- a dielectric (3), and
- a second electrically conducting layer (4),
- and with a protective layer (5),
- as well as at least one contact hole (6) which passes through the module, and
- a metallization which covers the module and the contact hole (6).
A method of manufacturing a module provided with a thin-film circuit on a substrate (1) of insulating material with at least one passive component, characterized in that
- a first electrically conducting layer (2) is deposited on a substrate (1) and structured,
- a dielectric (3) is deposited on the first structured electrically conducting layer (2),
- a second electrically conducting layer (4) is deposited on the dielectric (3) and structured,
- a protective layer (5) is provided on the second structured electrically conducting layer (4),
- the dielectric (3) and the protective layer (5) are structured,
- at least one contact hole (6) passing through the module is created, and
- a structured metallization is provided over the module and the contact hole (6).
A thin-film circuit on a substrate (1) of an insulating material provided with at least one passive component, which component comprises at least
- a first structured electrically conducting layer (2),
- a dielectric (3),
- a second electrically conducting layer (4),
- and provided with a protective layer (5),
- with at least one contact hole (6) which passes through the substrate (1), and
- with a structured metallization which covers the protective layer (5) and the contact hole (6).
Dependencies are inferred from the claim text.