An electronic device workpiece processing intermediate member

An electronic device workpiece processing apparatus comprising:

• a chuck including a surface, an electrical coupling adjacent the surface, and electrical interconnect configured to connect with the electrical coupling of the chuck and conduct a signal within the chuck;
• an intermediate member having a first surface and a second surface and the intermediate member including:
• an electrical coupling adjacent the first surface and configured to couple with the electrical coupling of the chuck;
• an electrical coupling adjacent the second surface;
• and
• an electrical interconnect configured to connect the electrical coupling adjacent the first surface and the electrical coupling adjacent the second surface;
• and
• an electronic device workpiece configured to couple with the second surface of the intermediate member, the electronic device workpiece including a sensor and an electrical coupling configured to provide electrical connection of the sensor with the electrical coupling of the second surface of the intermediate member.

An electronic device workpiece processing apparatus comprising:

• a chuck including a surface, a plurality of electrical couplings adjacent the surface, and a plurality of electrical interconnects configured to connect with respective electrical couplings of the chuck and conduct signals within the chuck;
• an intermediate member having a first surface and a second surface and the intermediate member including:
• a plurality of electrical couplings adjacent the first surface and configured to couple with respective electrical couplings of the chuck;
• a plurality of electrical couplings adjacent the second surface;
• and
• a plurality of electrical interconnects configured to electrically connect the electrical couplings of the first surface with respective electrical couplings of the second surface;
• a calibration workpiece configured to couple with the second surface of the intermediate member, the calibration workpiece including a plurality of resistance temperature devices configured to generate process signals, and a plurality of electrical connections configured to electrically connect the resistance temperature devices with respective electrical couplings of the second surface of the intermediate member;
• and
• a data gathering device coupled with the electrical interconnects of the chuck and configured to receive the process signals from the resistance temperature devices through the intermediate member and the chuck.

A method of communicating signals within an electronic device workpiece processing apparatus, the method comprising:

• providing a workpiece holder;
• providing an electronic device workpiece including a sensor;
• electrically coupling the sensor of the electronic device workpiece with the workpiece holder;
• sensing a condition using the sensor;
• generating a signal using the sensor responsive to the sensing;
• and
• conducting the signal through the workpiece holder following the coupling.

A method of communicating signals within an electronic device workpiece processing apparatus, the method comprising:

• providing a workpiece holder having circuitry;
• providing an electronic device workpiece having circuitry;
• and
• communicating signals intermediate the circuitry of the electronic device workpiece and the circuitry of the workpiece holder.