Mounting multiple semiconductor dies in a package
AssigneeMicron Technology, Inc.
InventorSalman Akram
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes multiple dies, in which a first die and a second die are mounted on a leadframe. The bond pads on the first and second dies are wirebonded to the leadframe. The first die, second die, and leadframe are encapsulated in a package.
Claims31
A multiple die package comprising:
- a pair of dies having bonding pads and front surfaces on which said bonding pads are located, said front surfaces facing oppositely from one another;
- and
- a leadframe, at least one of said dies secured on said leadframe and with a bonding pad of one of said dies electrically connected to said leadframe.
A multiple die package comprising:
- a pair of dies having bonding pads and front surfaces on which said bonding pads are located, said front surfaces facing in the same direction;
- a leadframe, at least one of said dies secured to said leadframe;
- and
- a spacer for spacing said dies from one another.
A method for mounting multiple semiconductor dies on a single leadframe, comprising:
- stacking at least two semiconductor dies having substantially the same rectangular dimensions on top of one another;
- and
- electrically connecting the semiconductor dies to the leadframe.
A method of connecting multiple semiconductor dies having bonding pads and a single leadframe having lead fingers, comprising:
- locating a first semiconductor die on the lead fingers of the leadframe;
- stacking a second semiconductor die on said first semiconductor die;
- and
- electrically connecting the bonding pads of the semiconductor dies to the lead fingers of the leadframe.
A semiconductor device, comprising:
- a plurality of semiconductor dies having about the same rectangular dimensions;
- a leadframe having lead fingers to which the semiconductor dies are mounted;
- and
- connectors for electrically connecting the dies to the leadframe.
A package for multiple semiconductor dies, comprising:
- a plurality of semiconductor dies stacked one on top of the other;
- a leadframe having lead fingers on which the semiconductor dies are mounted;
- and
- a package body for hermetically encapsulating the semiconductor dies and the leadframe.
A semiconductor device, comprising:
- a leadframe having a first surface, a second surface opposite said first surface, and lead fingers;
- a first die located on the first surface, the first die having bond pads which are electrically contacted to the lead fingers on the first surface of the leadframe;
- and
- a second die located on the second surface, the second die having bond pads which are electrically contacted to the lead fingers on the second surface of the leadframe.
An integrated circuit package, comprising:
- a leadframe having first and second surfaces;
- a support member mounted to a first surface of the leadframe;
- a first die mounted to the support member;
- and
- a second die mounted to a second surface of the leadframe.
Dependencies are inferred from the claim text.