EMI/RFI and vibration resistant electronics enclosure
OwnerDaniel P. Anagnosinventor
Life of this patent
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Abstract
A panel used in an enclosure for housing at least one electronic component, and an enclosure made of at least one of such panels is disclosed. The panel includes an electrically conductive layer, a separate, magnetically permeable layer connected to the electrically conductive layer, and a separate, extensionally damped layer covering at least 80 percent of a surface of the panel and attached to one or more of the electrically conductive layer and the magnetically permeable layer, where electrical and magnetic conductivity are maintained between all panels of the enclosure, and a ground is provided between circuitry of the electrical component and the electrically conductive layer.
Claims23
A panel for an enclosure for housing at least one electronic component, which comprises:
- an electrically conductive layer;
- a separate, magnetically permeable layer, connected to said electrically conductive layer;
- and
- a separate, extensionally damping layer, covering at least 80 percent of a surface of said panel, and attached to at least one of said electrically conductive layer and said magnetically permeable layer.
An enclosure for housing at least one electronic component, which comprises at least one panel, wherein each of said at least one panel comprises:
- an electrically conductive layer;
- a separate, magnetically permeable layer, connected to said electrically conductive layer;
- and
- a separate, extensionally damping layer, covering at least 80 percent of a surface of said panel, and attached to at least one of said electrically conductive layer and said magnetically permeable layer.
A method of making an enclosure for housing at least one electronic component, which comprises:
- providing at least one panel, which comprises:
- an electrically conductive layer, a separate, magnetically permeable layer, and a separate, extensionally damping layer;
- attaching said magnetically permeable layer to said electrically conductive layer;
- attaching said extensionally damping layer to at least one of said electrically conductive layer and said magnetically permeable layer, whereby at least 80 percent of a surface of said panel is covered with said extensionally damping layer;
- and
- maintaining electrical and magnetic conductivity between all of said at least one panel of said enclosure.
Dependencies are inferred from the claim text.