Polysilane composition for forming a coating suitable for bearing a metal pattern, metal pattern forming method, wiring board preparing method
OwnerMotoo Fukushima, Kunio Ito +1inventors
InventorsMOTOO FUKUSHIMA, KUNIO ITO, SHIGERU MORI
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Abstract
A metal pattern is prepared by applying a polysilane composition comprising a polysilane, a carbon functional silane, and a solvent onto a substrate to form a patterned coating of the polysilane composition, attaching catalytic metal nuclei to the patterned coating, and immersing the substrate in an electroless plating bath for thereby chemically depositing a metal film on the patterned coating.
Claims10
A polysilane composition for forming a metal pattern-bearing coating, comprising a polysilane, a carbon functional silane, and a solvent.
A method for preparing a wiring board comprising the steps of:
- (1) forming a thin film of a carbon functional silane-containing polysilane on a substrate and contacting a palladium salt with a surface of the polysilane thin film to form a palladium colloid layer thereon,
- (2) forming a photosensitive resin layer on the polysilane thin film having the palladium colloid layer, selectively irradiating light to the layer, and developing the layer, to thereby form a predetermined pattern of channels in the photosensitive resin layer so that the polysilane thin film having the palladium colloid layer is exposed within the channels, and
- (3) contacting an electroless plating solution with the polysilane thin film having the palladium colloid layer exposed within the channels, for thereby forming a conductive metal layer within the channels.
A method for preparing a wiring board comprising the steps of:
- (I) forming a thin film of polysilane with SiH group on a substrate and irradiating light to the thin film for crosslinking the polysilane for thereby insolubilizing the polysilane,
- (II) forming a photosensitive resin layer on the crosslinked polysilane thin film, selectively irradiating light to the layer, and developing the layer, to thereby form a predetermined pattern of channels in the photosensitive resin layer so that the crosslinked polysilane thin film is exposed within the channels, and
- (III) contacting a palladium salt with the crosslinked polysilane thin film exposed within the channels to form a palladium colloid layer and contacting an electroless plating solution for thereby forming a conductive metal layer within the channels.
Dependencies are inferred from the claim text.