US 2001/0012707 A1Published application

Integrated circuit socket with contact pad

AssigneeUrex Precision, Inc.

InventorsHan-Shin Ho, Wei-Hai Lai, Chien-Shuan Kuo, Deng-Tswen Shieh, Ming-Hsien Wang, Chin-Ting Whung

Life of this patent

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Abstract

An integrated circuit socket having a contact pad is disclosed. The integrated circuit socket comprises: (1) a base unit, it further consists of a base, contact pins and an elastomer. The contact pins will provide the electrical contact of the other elements, the elastomer provides the compactness of the assembly. (2) an interposer, there are a flexible film, a stiffener and a stop layer wherein the contact pad of the flexible film may contact with the solder ball of IC device to buffer the pressure formed by a tight contact when IC device is moving downward. The pressure will be dispersed with the flexible film such that the testing signals are transmitted. (3) an adapter unit, the unit is capable of positioning the integrated circuit device and includes a depressor to suppress or release the integrated circuit. (4) a cover unit, the cover unit is located over the base, the interposer and the adapter unit, and includes a cover and a spring such that the cover is coupled to the depressor of the adapter unit and is capable of vertically moving up and down.

Claims12

Dependent claims

An integrated circuit (IC) socket, said socket comprises:

a base unit, said base unit includes a base, a contact pin and an elastomer, said elastomer is located at the upper portion of said base and said contact pin is fastened inside a recessed portion of said base;
an interposer, said interposer includes a flexible film, a stop layer, and a stiffener, wherein said flexible film has a contact pad to connect a solder ball of a IC device to said contact pad, said stop layer located on said flexible film is used to buffer a pressure formed by a tight contact when said IC device is moving downward, and said stiffener located on said stop layer is used to support said flexible film and said stop layer;
an adapter unit, said adapter unit is placed on said base unit and said interposer and includes an adapter and a depressor, wherein said adapter unit provides the positioning function of said IC device, said depressor can suppress or release said IC device;
and
a cover unit, said cover unit is located over said base, said interposer and said adapter unit, and includes a cover and a spring, wherein said cover is coupled to said depressor of said adapter unit and is capable of moving up and down vertically.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 09/826,499Filed 5 Apr 2001
Priority: 7 Dec 1999
Published: 9 Aug 2001
Term ends: Not estimatedThe source records don’t support an estimate.

Classification7 codes

H05K 3/325
Electrically connecting electric components or wires to printed circuits: by abutting or pinching; Mechanical auxiliary parts therefor
H01R 12/714
Co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit: with…
G01R 1/0483
Sockets for IC's or transistors: sockets for unleaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged,…
H01R 2201/20
Connectors or connections adapted for particular applications: for testing or measuring purposes

Family

Application09/454,550Continuation in part · filed 7 Dec 1999
Application09/826,499Continuation in part · filed 5 Apr 2001
US 6,341,970 B1Related patent
US 6,383,005 B2Related patent
US 2001/0012707 A1This patent

From the US filing history. Foreign family members aren’t listed.

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