Semiconductor device and method for fabricating the same

A semiconductor device, comprising:

• a dielectric housing having a base plate and a surrounding wall extending upwardly from a periphery of said base plate, and cooperating with said base plate to confine a receiving space;
• a lead frame disposed inside said receiving space, said lead frame being provided with a plurality of leads, each of said leads having a first end disposed in said housing and a second end extending outwardly of said receiving space through said surrounding wall;
• a dielectric tape layer having a first adhesive surface adhered onto said leads in said receiving space of said housing, and a second adhesive surface opposite to said first adhesive surface, said dielectric tape layer being formed with a plurality of holes at positions registered with said leads for access thereto, each of said holes being confined by a wall that cooperates with a registered one of said leads to form a contact receiving space;
• a plurality of conductive contacts placed in said contact receiving spaces, respectively;
• a semiconductor die having a die mounting surface adhered onto said second adhesive surface of said dielectric tape layer, said die mounting surface being provided with a plurality of contact pads that are bonded to said conductive contacts to establish electrical connection with said leads of said lead frame;
• and
• a dielectric cover provided on said housing to seal said receiving space and retain said semiconductor die inside said receiving space.

A method for fabricating a semiconductor device, comprising:

• adhering a first adhesive surface of a dielectric tape layer on a plurality of leads that are provided on a lead frame, the dielectric tape layer being formed with a plurality of holes at positions registered with the leads for access thereto, each of the holes being confined by a wall that cooperates with a registered one of the leads to form a contact receiving space;
• placing a plurality of conductive contacts in the contact receiving spaces, respectively;
• and
• adhering a die mounting surface of a semiconductor die onto a second adhesive surface of the dielectric tape layer opposite to the first adhesive surface, and bonding a plurality of contact pads that are provided on the die mounting surface of the semiconductor die to the conductive contacts to establish electrical connection with the leads of the lead frame.

A method for fabricating a semiconductor device, comprising:

• providing a dielectric housing having a base plate and a surrounding wall that extends upwardly from a periphery of the base plate, and that cooperates with the base plate to confine a receiving space;
• placing a lead frame inside the receiving space of the housing such that each of a plurality of leads that are provided on the lead frame has a first end disposed in the housing and a second end extending outwardly of the receiving space through the surrounding wall;
• adhering a first adhesive surface of a dielectric tape layer onto the leads in the receiving space of the housing, the dielectric tape layer being formed with a plurality of holes at positions registered with the leads for access thereto, each of the holes being confined by a wall that cooperates with a registered one of the leads to form a contact receiving space;
• placing a plurality of conductive contacts in the contact receiving spaces, respectively;
• adhering a die mounting surface of a semiconductor die onto the second adhesive surface of the dielectric tape layer opposite to the first adhesive surface, and bonding a plurality of contact pads that are provided on the die mounting surface to the conductive contacts to establish electrical connection with the leads of the lead frame;
• and
• providing a dielectric cover on the housing to seal the receiving space and retain the semiconductor die inside the receiving space.