Semiconductor package with improved cross talk and grounding, and method of manufacturing same

A semiconductor device comprising:

• a semiconductor chip having a plurality of electrode pads formed on a peripheral portion of a front surface of the semiconductor chip;
• a plurality of leads constituted of outer leads and inner leads being integral with and extending from the outer leads, the inner leads having tips being connected to the electrode pads of the semiconductor chip;
• an insulating film for protecting surfaces on one side of the outer leads;
• external connection terminals formed on the outer leads;
• a conductive reinforcement plate provided so as to surround the semiconductor chip, and bonded to surfaces on the other side of the outer leads through an insulating adhesive layer;
• a conductive outer ring provided so as to surround the reinforcement plate, and electrically connected to at least one of the outer leads;
• and
• a conductive paste for filling in a space between the reinforcement plate and the outer ring.

A manufacturing method of a lead frame, comprising the steps of:

• forming a plurality of leads on a surface of a metal base of a laminated structure by metal plating;
• separating the plurality of leads from each other by selectively removing the metal base by etching;
• and
• forming bumps on tips of the respective separated leads, and then bonding a reinforcement plate to lead surfaces excluding bump forming regions thereof.

A manufacturing method of a lead frame, comprising the steps of:

• forming a plurality of leads on a surface of a metal base of a laminated structure by metal plating;
• covering given regions of the leads with an insulating film;
• and
• laying a solder material on the leads at given positions by electrolytic plating with the insulating film used as a mask, and, immediately thereafter, shaping the solder material into ball shapes by reflowing.

A manufacturing method of a semiconductor device, comprising the steps of:

• forming a plurality of leads on a surface of a metal base of a laminated structure by metal plating;
• covering given regions of the leads with an insulating film;
• separating the plurality of leads from each other by selectively removing the metal base by etching;
• forming bumps on tips of the respective separated leads, and then bonding a reinforcement plate to lead surfaces excluding bump forming regions thereof;
• and
• connecting electrodes of a semiconductor chip to the bumps;

A semiconductor device comprising:

• a conductive outer ring;
• a semiconductor chip having a plurality of electrode pads on a peripheral portion of a front surface of the semiconductor chip and disposed inside the conductive outer ring;
• a film circuit disposed and formed on the side of the front surface of the semiconductor chip;
• a plurality of external connection terminals formed on the film circuit so as to project therefrom;
• first leads for electrically connecting part of the electrode pads formed on the semiconductor chip to part of the external connection terminals formed on the film circuit;
• a second lead for electrically connecting a grounding or power supply electrode pad among the electrode pads formed on the semiconductor chip to the outer ring;
• a third lead for electrically connecting a grounding or power supply external connection terminal among the external connection terminals formed on the film circuit to the outer ring;
• and
• a conductive stage bonded to a back surface of the semiconductor chip and the outer ring through respective conductive bonding layers.

An electronic apparatus having a circuit board that is mounted with a semiconductor device, the semiconductor device comprising:

• a semiconductor chip having a plurality of electrode pads formed on a peripheral portion of a front surface of the semiconductor chip and an effective device region occupying an inside of the peripheral portion;
• an insulating protective layer laminated on the effective device region of the semiconductor chip;
• a plurality of leads constituted of outer leads and inner leads being integral with and extending from the outer leads, the inner leads having tips being connected to the electrode pads of the semiconductor chip;
• an insulating film for protecting the outer leads;
• external connection terminals formed on the outer leads and connected to the circuit board;
• a reinforcement plate provided so as to surround the semiconductor chip;
• and
• a sealing resin for filling in a peripheral space of the semiconductor chip.

An electronic apparatus having a circuit board that is mounted with a semiconductor device, the semiconductor device comprising:

• a semiconductor chip having a plurality of electrode pads formed on a peripheral portion of a front surface of the semiconductor chip;
• a plurality of leads constituted of outer leads and inner leads being integral with and extending from the outer leads, the inner leads having tips being connected to the electrode pads of the semiconductor chip;
• an insulating film for protecting surfaces, on one side, of the outer leads;
• external connection terminals formed on the outer leads and connected to the circuit board;
• a conductive reinforcement plate provided so as to surround the semiconductor chip, and bonded to surfaces, on the other side, of the outer leads through an insulating bonding layer;
• a conductive outer ring provided so as to surround the reinforcement plate and electrically connected to at least one of the outer leads;
• and
• a conductor paste for filling in a peripheral space between the reinforcement plate and the outer ring.