Multilayer thin-film wiring board

Abstract

A multilayer thin-film wiring board includes a base material provided with a plurality of wiring layers and an insulating layer laminated on the base material, and includes a via formed by laminating the wiring layers so as to be provided through the insulating layer. A plurality of branching vias are provided by forming a plurality of branches in at least one of the wiring layers forming the via, the plurality of branching vias being placed along a direction of extension of the base material. The plurality of branching vias are joined to one of the plurality of wiring layers which is placed at a position closest to the base material.

Dependencies are inferred from the claim text.