Method for making high k dielectric material with low k dielectric sheathed signal vias
AssigneeInternational Business Machines Corporation
InventorsMukta S. Farooq, Harvey C. Hamel, Robert A. Rita, Herbert I. Stoller
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Abstract
A multi-layer ceramic capacitor and method of manufacturing the capacitor, the capacitor having signal vias surrounded by an area containing a material having a low dielectric constant, the via and surrounding area of low dielectric constant material inserted in a material having a high dielectric constant.
Claims27
A multilayer ceramic capacitor wherein signal vias disposed in a material having a high dielectric constant in said capacitor are surrounded by an area containing low dielectric constant material whereby said capacitor is a high capacitance, low inductance structure.
A method for producing a metal via surrounded by a material of low dielectric constant, the via and the low dielectric constant material embedded in a material having a high dielectric constant comprising the steps of:
- a) forming at least one via having a predetermined diameter in a green sheet material having a low dielectric constant;
- b) filling said via with a selected metal paste and drying said sheet;
- c) selecting a second green sheet of a material having a high dielectric constant and forming at least one aperture therein, said aperture having a diameter equal to the desired diameter of said via surrounded by said material having a low dielectric constant;
- d) placing said sheet of low dielectric constant material above said material having a high dielectric constant and aligning a center line of said via with a center line of said aperture;
- and punching through said sheet of low dielectric constant material with a punch equal to or less than the diameter of said aperture, said punch having a central axis aligned with a central axis of said via and said aperture to create a plug of low dielectric constant material containing said via inserted into said aperture in said high dielectric constant material.
A structure comprising a metal via surrounded by a material of low dielectric constant, the via and the low dielectric constant material embedded in a material having a high dielectric constant produced by the steps of:
- a) forming at least one via having a predetermined diameter in a green sheet material having a low dielectric constant;
- b) filling said via with a selected metal paste and drying said sheet;
- c) selecting a second green sheet of a material having a high dielectric constant and forming at least one aperture therein, said aperture having a diameter equal to the desired diameter of said via surrounded by said material having a low dielectric constant;
- d) placing said sheet of low dielectric constant material above said material of high dielectric constant material and aligning a center line of said via with a center line of said aperture;
- and
- e) punching through said sheet of low dielectric constant material with a punch equal to or less than the diameter of said aperture, said punch having a central axis aligned with a central axis of said via and said aperture to create a plug of low dielectric constant material containing said via inserted into said aperture in said high dielectric constant material.
A multilayer ceramic capacitor comprising in combination:
- a capacitor structure being a plurality of layers of high dielectric contact material disposed between metallic electrodes;
- and
- at least one metal via passing through said layers of high dielectric constant material and said electrodes said metal via sheathed in a material of low dielectric constant separating said metal via from said high dielectric constant material and said electrodes.
A multilayer ceramic capacitor according to claim 22 including signal vias passing through said capacitor structure in a generally parallel relationship to said metal via.
Dependencies are inferred from the claim text.