US 2001/0011002 A1 · Wafer processing machine

Abstract

The wafer edge processing unit may be a stand alone unit or may be incorporated in existing grinding machines. The processing unit employs a plurality of tapes which are coated with differing grades of grit to sequentially polish the edge of a rotating wafer or to remove an edge bead from a processed wafer or the other substrate. The tapes are mounted on a backing block which is rotated to move the tapes from a line contact with the top bevel of the wafer to a line contact with the bottom bevel of the wafer. Fresh surfaces of the tapes are presented to successive wafers by rotating the spools on which the tapes are mounted. The wafer may be moved in small increments along a Y-axis and/or an X-axis relative to a tape during polishing to improve the polishing operation.

Claims28

Dependent claims

A wafer processing machine comprising

a chuck for holding a wafer thereon for rotation about an axis of rotation passing transversely through said chuck;
and
a wafer edge processing unit for working a peripheral edge of a wafer on said chuck during rotation of said chuck, said processing unit including a first means for positioning a working medium against the peripheral edge of a wafer on said chuck and a second means for moving the working medium in a plane perpendicular to said chuck during rotation of said chuck to place the working medium in contact with at least one side of the wafer on said chuck.

A wafer grinding and polishing machine comprising

a grinding station for grinding a peripheral edge of a wafer;
a polishing station for polishing the peripheral edge of a wafer ground in said grinding station, said polishing station including a rotatable chuck for receiving a wafer thereon for rotation about an axis of rotation passing perpendicularly of said chuck and a polishing unit for polishing a peripheral edge of a wafer on said chuck during rotation of said chuck, said polishing unit including a first means for positioning a polishing medium against the peripheral edge of a wafer on said chuck and a second means for moving the polishing medium in a plane perpendicular to said chuck during rotation of said chuck to place the polishing medium in contact with at least one side of the wafer on said chuck;
and
a conveyor for moving a wafer from said grinding station to said polishing station.

1 more element

Dependencies are inferred from the claim text.

Wafer processing machine

Life of this patent

Wafer processing machine

Life of this patent

Abstract

Claims28