Film ball grid array (BGA) semiconductor package

A flexible film substrate for use in forming a film BGA package, the flexible film substrate comprising:

• a flexible film having opposing upper and lower surfaces, the upper surface of the flexible film has a chip attaching area adapted for supporting a semiconductor chip;
• a plurality of chip connection pads arranged about the periphery of the chip attaching area for electrically connected to the semiconductor chip;
• a plurality of solder pads on the upper surface of the flexible film electrically connected to the corresponding chip connection pads, wherein the flexible film has a plurality of through-holes formed corresponding to the solder pads;
• and
• a dam on the upper surface of the flexible film disposed between the chip attaching area and the chip connection pads.

A method for manufacturing a flexible film substrate comprising the steps of:

• providing a flexible film having opposing upper and lower surfaces, the upper surface of the flexible film has a chip attaching area adapted for supporting a semiconductor chip;
• forming a plurality of through-holes in the flexible film;
• laminating a metal layer on the upper surface of the flexible film;
• etching the metal layer to form a plurality of solder pads, chip connection pads and conductive traces, wherein the solder pads are disposed corresponding to the through-holes and electrically connected to the chip connection pads through the conductive traces;
• and
• forming a dam on the upper surfaces of the flexible film such that the dam is disposed between the chip attaching area and the chip connection pads.