Semiconductor structure with chipset including multiple chips, memory, and method of forming same

A method of forming a semiconductor structure, comprising:

• providing a carrier board;
• forming a chipset on one side of the carrier board, wherein the chipset comprises a plurality of chips stacked in a direction perpendicular to the carrier board;
• wherein among the plurality of chips, an orthographic projection of a chip closer to the carrier board on the carrier board is within an orthographic projection of a chip farthest from the carrier board on the carrier board;
• forming an insulating dielectric layer covering the chipset;
• and
• performing a grinding process to expose a predetermined surface of the chip farthest from the carrier board outside the insulating dielectric layer, wherein performing the grinding process to expose the predetermined surface of the chip farthest from the carrier board outside the insulating dielectric layer comprises:
• grinding to remove the insulating dielectric layer by a first target thickness, to expose a top surface of the top chip;
• and
• grinding to remove the top chip and the insulating dielectric layer by a second target thickness, to expose the predetermined surface of the top chip, the second target thickness being not greater than the first target thickness.