Semiconductor packaging with transparency and method of manufacturing the same

A device, comprising:

• a base portion with a first surface and a second surface opposite to the first surface;
• a plurality of walls on the first surface, the plurality of walls protrude outward from the first surface, and each respective wall of the plurality of walls has an end surface that faces away from the base portion;
• a recess defined by a first surface of the base portion and the plurality of walls, and the recess is surrounded by the plurality of walls;
• a first die within the recess and on the first surface of the base portion;
• a second die within the recess and on the first surface of the base portion;
• a first wirebond having a first end coupled to the first die and a second end coupled to the base portion;
• a silicon-based transparent resin within the recess, the silicon transparent resin encasing the first die, the second die, and the first wirebond, the silicon-based transparent resin includes an exposed surface that faces away from the base portion and overlaps the first die and the second die, and the silicon-based transparent resin covers the end surfaces of the plurality of walls.

A device, comprising:

• a base portion with a first surface and a second surface opposite to the first surface;
• a plurality of walls on the first surface, the plurality of walls protrude outward from the first surface, and each respective wall of the plurality of walls has an end surface that faces away from the base portion;
• a recess defined by a first surface of the base portion and the plurality of walls, and the recess is surrounded by the plurality of walls;
• a first die within the recess and on the first surface of the base portion;
• a second die within the recess and on the first surface of the base portion;
• a first wirebond having a first end coupled to the first die and a second end coupled to the base portion;
• a silicon-based transparent resin within the recess, the silicon transparent resin encasing the first die, the second die, and the first widrebond, the silicon-based transparent resin includes an exposed surface that faces away from the base portion and overlaps the first die and the second die, and the exposed surface is recessed relative to the end surfaces of the plurality of walls.