Back to results
US 12,772,888 B2Granted
Component carrier with mounting protrusion
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorLonis Chen
Life of this patent
Estimating the term…
Abstract
A component carrier includes a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure and a mounting region arranged at the stack. The mounting region configured for mounting a component thereon and having at least one mounting protrusion for insertion of the component in at least one mounting recess.
Claims20
A component carrier, comprising:
- a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
- and
- a mounting region arranged at the stack, configured for mounting a component thereon, and the mounting region comprising:
- at least one mounting protrusion for insertion of the component by accommodating at least a part of the mounting protrusion in at least one mounting recess of the component,
- wherein the component carrier is configured as a panel.
2 more elements
A method of manufacturing a component carrier, comprising:
- providing a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
- and
- forming a mounting region at the stack, wherein forming the mounting region comprises
- forming at least one mounting protrusion, configured for insertion of the mounting protrusion into at least a portion of a mounting recess of a component, and
- arranging the component in the component carrier,
- wherein the component carrier is configured as a panel.
3 more elements
Dependencies are inferred from the claim text.