Electronic device

An electronic device used in the Universal Chiplet Interconnect Express (UCIe) standard, comprising:

• a substrate having a top surface and a bottom surface;
• and
• a first semiconductor device and a second semiconductor device disposed on the top surface of the substrate,
• wherein the substrate comprises an interconnect structure electrically connected between the first semiconductor device and the second semiconductor device, wherein the interconnect structure comprises:
• a first pad located on the top surface of the substrate, wherein the first pad is covered by the first semiconductor device;
• a first signal trace located below the first pad and partially covered by the first semiconductor device and the second semiconductor device;
• a first via structure electrically connected between the first pad and the first signal trace;
• and
• a second via structure electrically connected between the first via structure and the first signal trace,
• wherein the first signal trace extends in a first direction, the first via structure and the second via structure extend in a second direction, and the first via structure is misaligned with the second via structure in the second direction.