Package structure and method for manufacturing the same

A package structure, comprising:

• an interposer comprising a first interconnector and a second interconnector, wherein the interposer comprises a first edge, a second edge opposite to the first edge, and an upper surface extending from the first edge to the second edge, and wherein the first interconnector and the second interconnector are disposed on the upper surface of the interposer;
• a first electronic component over the upper surface of the interposer;
• a second electronic component over the upper surface of the interposer;
• and
• a third electronic component over the upper surface of the interposer;
• wherein the first electronic component and the second electronic component are disposed at a first horizontal level and electrically connected to each other through the first interconnector,
• wherein the second interconnector is electrically connected to the third electronic component disposed at a second horizontal level different from the first horizontal level,
• wherein a projection of the third electronic component in a horizontal direction does not overlap a projection of the first electronic component or second electronic component in the horizontal direction;
• and
• wherein a width of the interposer is less than a width of the first electronic component or a width of the second electronic component,
• wherein the first interconnector comprises a conductive pad having a first height protruding from the upper surface of the interposer, and the second interconnector comprises a conductive pillar having a second height protruding from the upper surface of the interposer, and wherein the second height is different from the first height, and both of the conductive pad and the conductive pillar are in contact with a solder material, and
• wherein the conductive pillar of the second interconnector extends along a lateral surface of the first electronic component, and a top surface of the conductive pillar of the second interconnector is substantially coplanar with a top surface of the first electronic component.