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US 12,772,872 B2Granted
Semiconductor device having heat sink part that promotes resin-flow
AssigneeMitsubishi Electric Corporation
InventorsShuhei Yokoyama, Shogo Shibata
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Abstract
A semiconductor apparatus includes: a heat sink; a die pad provided above and away from the heat sink; a power chip provided on a surface of the die pad opposite to a surface of the die pad facing the heat sink; and mold resin sealing a portion of the heat sink, the die pad and the power chip, wherein a surface of the heat sink facing the die pad includes a flow promotion part formed to separate from a plane including the die pad in a region overlapping the die pad and not overlapping the power chip.
Claims14
A semiconductor apparatus comprising:
- a heat sink;
- a die pad provided above and spaced apart from the heat sink and extending in a first direction;
- a power chip provided on a surface of the die pad opposite to a surface of the die pad facing the heat sink;
- and
- mold resin sealing a portion of the heat sink, the die pad and the power chip,
- wherein a surface of the heat sink facing the die pad includes a first portion and a second portion connected to the first portion, the first portion having a first surface extending in the first direction, and the second portion including a second surface extending in a second direction away from the die pad, the second surface beginning to extend away from the die pad in a region on the surface of the heat sink overlapping the die pad and not overlapping the power chip as viewed in a direction toward the surface of the heat sink.
3 more elements
Dependencies are inferred from the claim text.