Power electronic device and method for fabricating the same

A method for fabricating a power electronic device, the method comprising:

• providing a carrier comprising at least two die mounting areas, each of the die mounting areas being configured to accept a power semiconductor die;
• mounting at least one power semiconductor die on the carrier at a first one of the die mounting areas, the power semiconductor die comprising a first side and an opposite second side, wherein the first side faces the carrier;
• leaving a second one of the die mounting areas free of any semiconductor die;
• and
• arranging a contact clip over the power semiconductor die and over the second die mounting area such that the contact clip is at least partially arranged in a first plane;
• providing a second carrier;
• and
• electrically coupling the at least one power semiconductor die to the second carrier via the contact clip,
• wherein the second carrier comprises an identical layout of die mounting areas as the first carrier,
• wherein a first part of the contact clip over the power semiconductor die is bent downwards such that the first part is arranged in a second plane below the first plane and is coupled to the second side of the power semiconductor die,
• wherein a second part of the contact clip over the second die mounting area is bent upwards such that the second part is arranged in a third plane above the first plane, or the second part is free of any bend such that the second part is arranged in the first plane.