Semiconductor device

A semiconductor device comprising:

• a first lead;
• a first semiconductor element mounted on the first lead;
• and
• a sealing resin that covers the first semiconductor element,
• wherein the first lead comprises:
• a first die pad having a first main surface and a first back surface facing opposite sides to each other in a thickness direction;
• a second die pad arranged side by side with the first die pad in a first direction orthogonal to the thickness direction, and located on a side of the first main surface with respect to the first die pad in the thickness direction, the second die pad having a main surface facing the same side as the first main surface in the thickness direction;
• and
• a connecting portion connected to the first die pad and the second die pad, the connecting portion having a third main surface connected to the first main surface and the second main surface,
• wherein the first back surface is exposed from the sealing resin,
• wherein the second die pad has a second back surface facing a same side as the first back surface in the thickness direction,
• wherein the second back surface is arranged at a position different from the first back surface in the thickness direction, and
• wherein the connecting portion includes at least one selected from the group of a groove portion and a protrusion portion formed at the third main surface and configured to inhibit a flow of a fluid on the third main surface.