Semiconductor module having heat dissipation base surrounded by elastic member, power converter containing the same, and power converter manufacturing method therefor

A semiconductor module, comprising:

• a semiconductor chip;
• an insulated circuit substrate including a wiring board on a front surface thereof, the wiring board having the semiconductor chip bonded thereto;
• a heat dissipation base having a front surface and a rear surface opposite to each other, the front surface having a substrate region to which the insulated circuit substrate is bonded, the rear surface having
• a heat dissipation region overlapping the substrate region in a plan view of the semiconductor module and
• a loop-shaped region surrounding the heat dissipation region,
• the heat dissipation base having a plurality of fastening holes through which fastening members are to be inserted, the fastening holes being located outside the substrate region and being surrounded by the loop-shaped region;
• a solid heat dissipation member made of a phase change material, provided on the rear surface of the heat dissipation base in the heat dissipation region;
• and
• an elastic member on the rear surface of the heat dissipation base in the loop-shaped region.