Semiconductor device with dual downset leadframe and method therefor

A semiconductor device comprising:

• a leadframe including a plurality of leads, a first lead of the plurality of leads having a lead pad formed from a same contiguous metal between a distal portion of the first lead and a proximal portion of the first lead, the lead pad located on a plane above the proximal portion;
• a semiconductor die having a plurality of bond pads located at an active side of the semiconductor die, each bond pad of the plurality of bond pads connected to a respective lead of the plurality of leads;
• and
• an encapsulant encapsulating the semiconductor die and at least a portion of the leadframe, a distal portion of each lead of the plurality of leads exposed through the encapsulant at a first major side, the distal portion of each lead of the plurality of leads exposed through the encapsulant being configured for connection to a printed circuit board, and the lead pad exposed through the encapsulant at a second major side opposite of the first major side.