Integrated circuit supports with microstrips
AssigneeIntel Corporation
InventorsWenzhi Wang, Xiaoning Ye, Yunhui Chu, Chunfei Ye, James A. McCall
Life of this patent
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Abstract
Disclosed herein are integrated circuit (IC) supports with microstrips, and related embodiments. For example, an IC support may include a plurality of microstrips and a plurality of conductive segments. Individual ones of the conductive segments may be at least partially over at least two microstrips, a dielectric material may be between the plurality of microstrips and the plurality of conductive segments, and the conductive segments are included in a tape.
Claims20
An integrated circuit (IC) component, comprising:
- a first microstrip, wherein the first microstrip includes a first conductive line, a ground plane, and a first dielectric material between the first conductive line and the ground plane;
- a second microstrip, wherein the second microstrip includes a second conductive line coplanar with the first conductive line;
- a second dielectric material at least partially over the first conductive line and the second conductive line;
- and
- a conductive segment, wherein the second dielectric material is between the conductive segment and the first conductive line, the second dielectric material is between the conductive segment and the second conductive line, the conductive segment is at least partially over the first conductive line and at least partially over the second conductive line, the conductive segment is included in a tape, and the first conductive line and the second conductive line are external to the tape.
A tape for use in an integrated circuit (IC) support, comprising:
- a first conductive segment, wherein, when the tape is applied to an underlying structure including a first conductive line, a second conductive line, and a third conductive line, the first conductive segment is at least partially over the first conductive line and at least partially over the second conductive line, wherein a conductivity of the first conductive segment is less than a conductivity of the first conductive line;
- and
- a second conductive segment, wherein, when the tape is applied to the underlying structure, the second conductive segment is at least partially over the second conductive line and at least partially over the third conductive line.
An electronic device, comprising:
- an integrated circuit (IC) device;
- and
- an IC structure coupled to the IC device, wherein the IC structure includes:
- a plurality of microstrips, and
- a plurality of conductive segments, wherein individual ones of the conductive segments are at least partially over at least two microstrips, a dielectric material is between the plurality of microstrips and the plurality of conductive segments, the plurality of conductive segments are included in a tape, and the plurality of microstrips are not included in the tape.
Dependencies are inferred from the claim text.