Electronic apparatus
AssigneeKioxia Corporation
InventorKazuyuki Matsuzaki
Life of this patent
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Abstract
An electronic apparatus includes a first substrate, a second substate, and an elastic member. The first substrate has a first surface on which a metal member is provided. The second substrate is coupled to the first substrate above the first surface and on which a plurality of electronic components is mounted. The second substrate has a second surface that faces away from the first surface. The elastic member has an inner surface that contacts the second surface or at least one of the electronic components and an outer surface that faces the first surface and is in thermal contact with the metal member.
Claims20
An electronic apparatus comprising:
- a first substrate having a first surface on which a metal member is provided;
- a second substrate coupled to the first substrate above the first surface and on which a plurality of electronic components are mounted, the second substrate having a second surface that extends along the first surface and away from the first surface, the plurality of electronic components being disposed on the second surface and including one or more memory chips and a controller chip configured to control the one or more memory chips;
- and an elastic member having a through-hole that extends in a first direction along the second surface and through which the second substrate extends in the first direction, the elastic member having, in the through-hole, an inner surface that contacts the second surface or at least one of the plurality of the electronic components, and having an outer surface that faces the first surface and is in thermal contact with the metal member and remove heat through the first substrate.
An electronic apparatus comprising:
- a first substrate having a first surface on which a metal member is provided;
- a second substrate coupled to the first substrate above the first surface and on which a plurality of electronic components are mounted, the second substrate having a second surface that extends along the first surface and away from the first surface, the plurality of electronic components being disposed on the second surface and including one or more memory chips and a controller chip configured to control the one or more memory chips;
- and an elastic member having a through-hole that extends in a first direction along the second surface and through which the second substrate extends in the first direction, the elastic member having, in the through-hole, a side surface that contacts a side edge of the second substrate, and having a bottom surface that faces the first surface and is in thermal contact with the metal member and remove heat through the first substrate.
Dependencies are inferred from the claim text.